The Title III program has identified 3D High Density Microelectronics for Information Protection as a technology area of interest for its future activities, and interested firms are encouraged to determine if they have information pertaining to this topic.

For the purpose of this RFI, the

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Government is defining 3D High Density Microelectronics for Information Protection as three-dimensional (3D), ultra-high density microelectronics modules for use in Critical Program Information (CPI) protection applications.

The focus shall be on product yield improvement and the expansion of production facilities to create an economically viable DoD and commercial supplier of 3D microelectronics modules incorporating Information Protection.

Note:
The program funding above ($100,000) is an estimate only and does not reflect any potential program funding which will be determined at a later date.