Defense Production Act (DPA) Title III 3D Microelectronics for Information Protection Program

The objective of this DPA Title III Project is to expand existing domestic supplier production capabilities to produce three-dimensional (3D), ultra-high density microelectronics modules for use in Critical Program Information (CPI) protection applications.

The focus of this effort shall

be on product yield improvement and the expansion of production facilities to create an economically viable DoD supplier of 3D microelectronics modules incorporating Information Protection.

The quality of ultra-high density modules produced throughout this effort will be verified against current industry standards; quality verification efforts will include production and testing of the 3D ultra-high density microelectronics modules.
Agency: Department of Defense

Office: Air Force -- Research Lab

Estimated Funding: $13,200,000


Who's Eligible



Obtain Full Opportunity Text:
Not Available

Additional Information of Eligibility:
Not Available

Full Opportunity Web Address:


Contact:
Dianna AnitonAgreements OfficerPhone 937-713-9897

Agency Email Description:
For Questions & Assistance

Agency Email:
dianna.aniton@us.af.mil

Date Posted:
2016-06-15

Application Due Date:
2016-08-08

Archive Date:
2016-08-31



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